About 2.1 Speaker
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Users questions:Some 2.1 speaker independent power amplifier (2.1 +1), we know that an independent amplifier with built-in amplifier sound quality any difference?
Experts answer: The simplest answer is: because there is a separate enclosure, amplifier and speakers do not have to squeeze together. Such an outcome, for they are good for both sides. The advent of independent power amplifier process is reflected in the independent power amplifier built-in power amplifier design compared to the greatest advantage, that is, the absence of an independent power amplifier built-in volume limit, it can be done better heat dissipation. Built-in speaker amplifier, caused by the thermal effect in a poor seal wooden body, with control only through the invertedConvection for cooling. Although the use of metal backplane, external heat sink approach can solve the power amplifier chip cooling, but transformers and other components of the heat dissipation or heat can not be resolved. For independent power amplifier, although the same power amplifier circuit was enclosed in a box, but unlike the speaker amplifier box, noSealing requirements, so the location of components in heat out a large number of cooling holes, making the heat quickly through the divergence of natural convection out. This is particularly important for high-power amplifier.
Experts answer: The simplest answer is: because there is a separate enclosure, amplifier and speakers do not have to squeeze together. Such an outcome, for they are good for both sides. The advent of independent power amplifier process is reflected in the independent power amplifier built-in power amplifier design compared to the greatest advantage, that is, the absence of an independent power amplifier built-in volume limit, it can be done better heat dissipation. Built-in speaker amplifier, caused by the thermal effect in a poor seal wooden body, with control only through the invertedConvection for cooling. Although the use of metal backplane, external heat sink approach can solve the power amplifier chip cooling, but transformers and other components of the heat dissipation or heat can not be resolved. For independent power amplifier, although the same power amplifier circuit was enclosed in a box, but unlike the speaker amplifier box, noSealing requirements, so the location of components in heat out a large number of cooling holes, making the heat quickly through the divergence of natural convection out. This is particularly important for high-power amplifier.
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